The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Sep. 09, 2014
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Kosuke Morita, Ibaraki, JP;
Tsuyoshi Ishizaka, Ibaraki, JP;
Eiji Toyoda, Ibaraki, JP;
Goji Shiga, Ibaraki, JP;
Chie Iino, Ibaraki, JP;
Jun Ishii, Ibaraki, JP;
NITTO DENKO CORPORATION, Osaka, JP;
Abstract
The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient α [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E' [GPa] at 25° C. of the thermally cured product satisfy the following formula (2):30≦≦120 [kJ/mol]  (1); and10,000≦α×′≦300,000 [Pa/K]  (2).