The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Dec. 21, 2015
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Hideomi Kumano, Tokyo, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/4763 (2006.01); H01L 23/538 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/5381 (2013.01); H01L 27/1464 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/48463 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A step of forming a connecting member configured to electrically connect a first conductive line and a second conductive line includes a phase of perforating a laminate from a first semiconductor wafer to form a plurality of connection holes that reach the second conductive line and a phase of filling the plurality of penetrating connection holes with a conductive material to form conductive sections in contact with the second conductive line.