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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9659836 B1

PDFFull Text
Date of Patent:
May. 23, 2017

Filed:

Dec. 01, 2015

Heat dissipation structure, fabricating method, and electronic apparatus

Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Yukie Sakita, Atsugi, JP;

Yoshitaka Yamaguchi, Atsugi, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:

Fujitsu Patent Center

Primary Examiner:

Robert J Hoffberg

Int. Cl.
CPC ...
H01L 23/373 (2006.01); H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01); B23P 15/26 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); F28F 13/18 (2006.01); F28F 21/02 (2006.01); H01L 23/31 (2006.01); B82Y 30/00 (2011.01); B82Y 10/00 (2011.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); B23P 15/26 (2013.01); B82Y 30/00 (2013.01); C23C 16/40 (2013.01); C23C 16/403 (2013.01); C23C 16/45525 (2013.01); C23C 16/45555 (2013.01); F28F 13/185 (2013.01); F28F 21/02 (2013.01); H01L 23/3157 (2013.01); H01L 23/367 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H05K 7/2039 (2013.01); B82Y 10/00 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29486 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8334 (2013.01); H01L 2924/15788 (2013.01); Y10S 977/742 (2013.01);
Abstract

Disclosed is a heat dissipation structure that includes a plurality of linear structures made of carbon, each of the linear structures having at least one of a first end and a second end being bent, and a coating layer formed on a surface of each of the linear structures, the coating layer having a part covering the other one of the first ends and the second ends of the linear structures, a thickness of the part allowing the corresponding linear structures to be plastically deformable.

Find Patent Forward Citations

Sakita, Yukie. (2017). Heat dissipation structure, fabricating method, and electronic apparatus (U.S. Patent No. 9659836). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9659836

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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