The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Jul. 19, 2012
Applicants:
Albert M. Giorgini, Lino Lakes, MN (US);
Andrew Hilley, Stirlingshire, GB;
Inventors:
Albert M. Giorgini, Lino Lakes, MN (US);
Andrew Hilley, Stirlingshire, GB;
Assignee:
H.B. Fuller Company, St. Paul, MN (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/29 (2006.01); C08G 18/10 (2006.01); C09J 5/00 (2006.01); C09J 175/04 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08G 18/10 (2013.01); C09J 5/00 (2013.01); C09J 175/04 (2013.01); H01L 21/02 (2013.01); H01L 21/50 (2013.01); H01L 21/563 (2013.01); H01L 23/10 (2013.01); H01L 23/3121 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08G 2170/20 (2013.01); C09J 2203/318 (2013.01); C09J 2203/322 (2013.01); C09J 2203/326 (2013.01); C09J 2423/00 (2013.01); C09J 2475/00 (2013.01); H01L 23/564 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/2731 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27418 (2013.01); H01L 2224/27422 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/83877 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/005 (2013.01); Y10T 428/239 (2015.01);
Abstract
The disclosure relates to a method of making an electronic assembly with a reactive hot-melt adhesive composition that include an atmospheric curing prepolymer and optionally a thermoplastic component with a softening point of at least about 120° C., and the electronic assembly made therewith.