The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Oct. 15, 2013
Mitsubishi Electric Corporation, Tokyo, JP;
Tamio Matsumura, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
According to the present invention, a semiconductor-element manufacturing method including the steps of cutting out a ring portion of a wafer with laser light to form a flat wafer, the ring portion being formed on a periphery of the wafer and thicker than a central portion of the wafer, the wafer having a first surface and a second surface opposite to the first surface, with the first surface of the wafer being held on a vacuum stage by suction, attaching the first surface to dicing tape after detaching the flat wafer from the vacuum stage with the second surface of the flat wafer being held by a vacuum end-effector by suction, and dicing the flat wafer attached to the dicing tape.