The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Jan. 25, 2013
Tdk Corporation, Tokyo, JP;
Sae Magnetics (H.k.) Ltd., Hong Kong, CN;
Seiichi Takayama, Tokyo, JP;
Yasuhiro Ito, Tokyo, JP;
Nobuyuki Mori, Tokyo, JP;
Koji Shimazawa, Tokyo, JP;
Kazuaki Takanuki, Tokyo, JP;
Youichi Ando, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
SAE MAGNETICS (H.K.) LTD., Hong Kong, CN;
Abstract
A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again.