The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Jun. 30, 2014
Applicant:

Schlumberger Technology Corporation, Sugar Land, TX (US);

Inventors:

Ramon Hernandez Marti, Houston, TX (US);

Bo Chen, Sugar Land, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01V 13/00 (2006.01); E21B 47/01 (2012.01); G01V 11/00 (2006.01);
U.S. Cl.
CPC ...
G01V 11/002 (2013.01); E21B 47/011 (2013.01); G01V 13/00 (2013.01); Y10T 29/49002 (2015.01);
Abstract

The present disclosure introduces pressure-equalized packaging for electronic sensors utilized in conjunction with downhole tools and/or other extreme environments. Such sensors may be operable to detect, sense, and/or measure a parameter, such as may be associated with the downhole tool, or pressurized fluid in which the downhole tool is at least partially submerged, or a subterranean formation adjacent the downhole tool. A housing couples the sensor to a component of the downhole tool. The housing includes an equalizer operable to substantially equalize a first pressure internal to the housing with a second pressure external to the housing.


Find Patent Forward Citations

Hernandez Marti, Ramon. (2017). Pressure equalized packaging for electronic sensors (U.S. Patent No. 9658362). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9658362

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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