The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Jun. 27, 2014
Applicant:

Wistron Neweb Corp., Hsinchu, TW;

Inventors:

Babak Radi, Hsinchu, TW;

Shih-Hong Chen, Hsinchu, TW;

Yu-Fu Kuo, Hsinchu, TW;

Tzu-Wen Chuang, Hsinchu, TW;

Assignee:

Wistron NeWeb Corp., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); C25D 5/02 (2006.01); C25D 5/56 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); C25D 5/56 (2013.01); H05K 3/105 (2013.01); H05K 3/24 (2013.01); H05K 2201/0257 (2013.01); H05K 2203/107 (2013.01);
Abstract

A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.


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