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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9657197 B1

PDFFull Text
Date of Patent:
May. 23, 2017

Filed:

Sep. 12, 2012

Adhesive, adhesive layer, and adhesive sheet

Applicants:

Masatsugu Higashi, Ibaraki, JP;

Kiyoe Shigetomi, Ibaraki, JP;

Koji Shitara, Ibaraki, JP;

Akiko Tanaka, Ibaraki, JP;

Katsuhiko Kamiya, Ibaraki, JP;

Azusa Iseki, Ibaraki, JP;

Inventors:

Masatsugu Higashi, Ibaraki, JP;

Kiyoe Shigetomi, Ibaraki, JP;

Koji Shitara, Ibaraki, JP;

Akiko Tanaka, Ibaraki, JP;

Katsuhiko Kamiya, Ibaraki, JP;

Azusa Iseki, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Anish Desai

Int. Cl.
CPC ...
B32B 7/12 (2006.01); C09J 7/02 (2006.01); C09J 133/14 (2006.01); C08F 220/18 (2006.01); C08F 226/06 (2006.01); C08G 18/62 (2006.01); C08G 18/80 (2006.01); C09J 175/04 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); G02F 1/1333 (2006.01); H01B 5/00 (2006.01); C08F 222/10 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0217 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 27/36 (2013.01); C08F 220/18 (2013.01); C08F 226/06 (2013.01); C08G 18/6266 (2013.01); C08G 18/8029 (2013.01); C09J 133/14 (2013.01); C09J 175/04 (2013.01); G02F 1/13338 (2013.01); H01B 5/002 (2013.01); B32B 2307/202 (2013.01); B32B 2307/412 (2013.01); B32B 2307/516 (2013.01); B32B 2457/00 (2013.01); B32B 2457/202 (2013.01); B32B 2457/204 (2013.01); C08F 222/1006 (2013.01); C08G 2170/40 (2013.01); C09J 2203/318 (2013.01); C09J 2433/00 (2013.01); C09J 2467/006 (2013.01); G02F 2202/28 (2013.01); Y10T 428/2891 (2015.01);
Abstract

A pressure-sensitive adhesive of the invention include a (meth)acryl-based polymer obtained by polymerization of a monomer component including 30 to 99.5% by weight of an alkyl (meth)acrylate having an alkyl group of 10 to 18 carbon atoms at an ester end and 0.5 to 50% by weight of a cyclic nitrogen-containing monomer. The pressure-sensitive adhesive has a satisfactory level of adhesive performance and can form a pressure-sensitive adhesive layer with a lower dielectric constant and reliable moisture resistance.

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