The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

May. 29, 2015
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Toshihide Ezoe, Shizuoka, JP;

Yuki Nara, Shizuoka, JP;

Kazuto Shimada, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 7/00 (2006.01); C09D 7/12 (2006.01); C09D 201/00 (2006.01); G02B 5/22 (2006.01); H04N 5/225 (2006.01); H01L 27/146 (2006.01); C09D 5/00 (2006.01); G02B 1/11 (2015.01); C08K 5/55 (2006.01);
U.S. Cl.
CPC ...
C09D 7/007 (2013.01); C09D 5/00 (2013.01); C09D 7/12 (2013.01); C09D 201/00 (2013.01); G02B 1/11 (2013.01); G02B 5/223 (2013.01); H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01); H04N 5/2254 (2013.01); C08K 5/55 (2013.01); H01L 2224/13 (2013.01);
Abstract

There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 μm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 μm or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.


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