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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9657154 B1

PDFFull Text
Date of Patent:
May. 23, 2017

Filed:

Dec. 24, 2014

Resin composition and uses of the same

Applicant:

Taiwan Union Technology Corporation, Chupei, Hsinchu County, TW;

Inventors:

Shur-Fen Liu, Chupei, TW;

Meng-Huei Chen, Chupei, TW;

Hsin-Ho Wu, Chupei, TW;

Assignee:

TAIWAN UNION TECHNOLOGY CORPORATION, Chupei, Hsinchu County, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Doris Lee

Int. Cl.
CPC ...
C08K 3/22 (2006.01); C08L 63/00 (2006.01); C08L 37/00 (2006.01); C08L 71/02 (2006.01); C08K 5/02 (2006.01); C08J 5/24 (2006.01); B32B 15/08 (2006.01); B32B 27/20 (2006.01); C08J 5/10 (2006.01); C09D 163/00 (2006.01); C08G 59/68 (2006.01);
U.S. Cl.
CPC ...
C08K 3/22 (2013.01); B32B 15/08 (2013.01); B32B 27/20 (2013.01); C08G 59/686 (2013.01); C08J 5/10 (2013.01); C08J 5/24 (2013.01); C08K 5/02 (2013.01); C08L 37/00 (2013.01); C08L 63/00 (2013.01); C08L 71/02 (2013.01); C09D 163/00 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2264/107 (2013.01); B32B 2305/076 (2013.01); B32B 2457/08 (2013.01); C08J 2335/06 (2013.01); C08J 2337/00 (2013.01); C08J 2363/00 (2013.01); C08J 2371/02 (2013.01); C08J 2371/12 (2013.01); C08J 2435/06 (2013.01); C08J 2437/00 (2013.01); C08J 2463/00 (2013.01); C08J 2471/02 (2013.01); C08K 2003/2206 (2013.01); C08K 2003/2237 (2013.01); Y10T 428/31678 (2015.04);
Abstract

A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Find Patent Forward Citations

Liu, Shur-Fen. (2017). Resin composition and uses of the same (U.S. Patent No. 9657154). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9657154

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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