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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9657117 B1

PDFFull Text
Date of Patent:
May. 23, 2017

Filed:

May. 09, 2014

4-methyl-1-pentene polymer, resin composition containing 4-methyl-1-pentene polymer, masterbatch thereof, and formed product thereof

Applicant:

Mitsui Chemicals, Inc., Minato-ku, Tokyo, JP;

Inventors:

Kuniaki Kawabe, Ichihara, JP;

Masayoshi Sutou, Ichihara, JP;

Toshiyuki Itou, Ichihara, JP;

Mai Kurihara, Ichihara, JP;

Akinori Etoh, Ichihara, JP;

Shinichirou Asao, Ichihara, JP;

Kenji Sugimura, Iwakuni, JP;

Hiroshi Hoya, Chiba, JP;

Koji Matsunaga, Yokohama, JP;

Yoji Hayakawa, Chiba, JP;

Kunihiko Mizumoto, Chiba, JP;

Assignee:

MITSUI CHEMICALS, INC., Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Kelechi Egwim

Int. Cl.
CPC ...
C08F 10/14 (2006.01); C08F 210/14 (2006.01); C08J 5/18 (2006.01); C08L 23/00 (2006.01); C08L 23/06 (2006.01); C08L 23/12 (2006.01); C08J 3/22 (2006.01); C08L 23/22 (2006.01); C08L 63/00 (2006.01); C08L 67/00 (2006.01); C08L 69/00 (2006.01); C08L 77/00 (2006.01); C09J 7/02 (2006.01); C08L 77/02 (2006.01); C08L 23/20 (2006.01);
U.S. Cl.
CPC ...
C08F 10/14 (2013.01); C08F 210/14 (2013.01); C08J 3/226 (2013.01); C08J 5/18 (2013.01); C08L 23/00 (2013.01); C08L 23/06 (2013.01); C08L 23/12 (2013.01); C08L 23/22 (2013.01); C08L 63/00 (2013.01); C08L 67/00 (2013.01); C08L 69/00 (2013.01); C08L 77/00 (2013.01); C08L 77/02 (2013.01); C09J 7/0264 (2013.01); C08J 2323/02 (2013.01); C08J 2323/06 (2013.01); C08J 2323/12 (2013.01); C08J 2367/00 (2013.01); C08J 2369/00 (2013.01); C08J 2377/00 (2013.01); C08J 2377/02 (2013.01); C08J 2423/20 (2013.01); C08L 23/20 (2013.01); C09J 2423/006 (2013.01); C09J 2463/006 (2013.01); C09J 2467/006 (2013.01); C09J 2469/006 (2013.01); C09J 2477/006 (2013.01); Y10T 428/28 (2015.01);
Abstract

[Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [η] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.

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