The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Mar. 10, 2015
Applicant:

Gwangju Institute of Science and Technology, Buk-gu, Gwangju, KR;

Inventors:

Heung Cho Ko, Gwangju, KR;

Seok Ho Kim, Gwangju, KR;

Jongwon Yoon, Gwangju, KR;

Young Kyu Hwang, Gwangju, KR;

Su Ok Yun, Gwangju, KR;

Hun Soo Jang, Gwangju, KR;

Seong-Ju Park, Gwangju, KR;

Hyun-A Cho, Gwangju, KR;

Byeong-Il Noh, Gwangju, KR;

Jaeyi Chun, Gwangju, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B41N 1/12 (2006.01); B32B 38/10 (2006.01); B32B 3/30 (2006.01); B41C 1/00 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
B41N 1/12 (2013.01); B32B 3/30 (2013.01); B32B 38/10 (2013.01); B41C 1/00 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); Y10T 428/24521 (2015.01); Y10T 428/24529 (2015.01);
Abstract

The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. The present invention allows a process of manufacturing a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process.


Find Patent Forward Citations

Loading…