The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Nov. 28, 2013
Applicant:

Kaneka Corporation, Osaka-shi, Osaka, JP;

Inventors:

Takashi Urabe, Shiga, JP;

Hisayasu Kaneshiro, Shiga, JP;

Koji Hanada, Shiga, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 47/16 (2006.01); B29B 11/00 (2006.01); B29L 7/00 (2006.01); B29K 79/00 (2006.01); B29C 47/00 (2006.01); B29C 47/08 (2006.01);
U.S. Cl.
CPC ...
B29B 11/00 (2013.01); B29C 47/16 (2013.01); B29C 47/0021 (2013.01); B29C 47/0808 (2013.01); B29K 2079/085 (2013.01); B29L 2007/008 (2013.01);
Abstract

A film is formed by extruding a resin from a lip opening () of a multilayer extrusion die () in a state in which a rectifying jig () does not cover the lip opening () but covers a seal part () while being located adjacent to each end in a longer side direction of the lip opening ().


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