The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Apr. 15, 2013
Applicant:

Zimmer, Inc., Warsaw, IN (US);

Inventors:

Steven Charlebois, Goshen, IN (US);

Leslie N. Gilbertson, Warsaw, IN (US);

Michael E Hawkins, Columbia City, IN (US);

Dana Medlin, Warsaw, IN (US);

H. Ravindranath Shetty, Warsaw, IN (US);

Steven Zawadzki, Leesburg, IN (US);

Assignee:

Zimmer, Inc., Warsaw, IN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23P 23/00 (2006.01); A61F 2/30 (2006.01); A61L 27/04 (2006.01); A61L 27/30 (2006.01); A61L 27/56 (2006.01); B22F 7/00 (2006.01); B22F 7/06 (2006.01); C23C 26/00 (2006.01); A61F 2/38 (2006.01); A61F 2/34 (2006.01);
U.S. Cl.
CPC ...
B23P 23/00 (2013.01); A61F 2/30767 (2013.01); A61F 2/30907 (2013.01); A61L 27/04 (2013.01); A61L 27/30 (2013.01); A61L 27/56 (2013.01); B22F 7/004 (2013.01); B22F 7/064 (2013.01); C23C 26/00 (2013.01); A61F 2/3094 (2013.01); A61F 2/3859 (2013.01); A61F 2002/30787 (2013.01); A61F 2002/30967 (2013.01); A61F 2002/30968 (2013.01); A61F 2002/30978 (2013.01); A61F 2002/3401 (2013.01); A61F 2310/00023 (2013.01); A61F 2310/00029 (2013.01); A61F 2310/00407 (2013.01); A61F 2310/00544 (2013.01); Y10T 29/49861 (2015.01);
Abstract

A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.


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