The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2017
Filed:
Dec. 01, 2014
Applicant:
Hiroshima University, Higashihiroshima-shi, Hiroshima, JP;
Inventors:
Kazuhiro Matsugi, Higashihiroshima, JP;
Kenichiro Suetsugu, Nishinomiya, JP;
Assignee:
Hiroshima University, Hiroshima, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); B23K 35/02 (2006.01); C22C 12/00 (2006.01); H01L 21/52 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/264 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); C22C 12/00 (2013.01); H01L 21/52 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 23/562 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H05K 3/3457 (2013.01); H01L 2224/3226 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01083 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/181 (2013.01);
Abstract
Provided is a solder material that has a high melting point and exhibits superior mechanical characteristics, and therefore can form a connecting portion with high heat-resistant reliability.