The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Jun. 17, 2014
Applicant:

Wolverine Tube, Inc., Decatur, AL (US);

Inventors:

Sy-Jenq Loong, Madison, AL (US);

Donald Lynn Smith, Danville, AL (US);

Assignee:

Wolverine Tube, Inc., Decatur, AL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P 13/04 (2006.01); H05K 13/00 (2006.01); H01L 21/48 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0023 (2013.01); H01L 21/4878 (2013.01); H01L 23/473 (2013.01); H05K 7/20254 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0306 (2013.01); H05K 3/0061 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49124 (2015.01); Y10T 83/0341 (2015.04);
Abstract

A substrate for electronic components is formed by bonding a cooling metal layer to one side of a ceramic tile and bonding an electronic metal layer to the other side of the electronic tile. The substrate is secured to a machining base and the cooling metal layer surface is enhanced through an MDT process. In the process, fins are sliced into the cooling metal layer with a tool to a depth of less than the cooling metal layer thickness. The slicing forces material upward without removing material from the cooling metal layer, forming fins that extend beyond the original thickness of the cooling metal layer. The fins can be cross-sliced at an angle to form pins.


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