The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Feb. 20, 2015
Applicant:

Via Mechanics, Ltd., Ebina-shi, Kanagawa Pref., JP;

Inventors:

Yujiro Araki, Zama, JP;

Toru Yuki, Ebina, JP;

Katsunori Tokinaga, Atsugi, JP;

Assignee:

Via Mechanics, Ltd., Ebina-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0047 (2013.01); H05K 1/0251 (2013.01); H05K 3/429 (2013.01); H05K 2203/0207 (2013.01); Y10T 408/03 (2015.01); Y10T 408/173 (2015.01);
Abstract

The present invention aims to provide a backdrilling method and a backdrilling apparatus that can ensure the backdrilling depth accuracy. Using a multilayer printed wiring board in which a reference depth detection region is allocated where a reference depth detection layer is formed in the same layer with an internal wiring layer electrically connected to a stub, the thickness and the depth of the reference depth detection layer are measured in the reference depth detection region using a drill bit. The drill bit is moved relative to the multilayer printed wiring board to a backdrilling portion. The drilling is performed using the drill bit to the depth which is calculated using the ratio of the depth of the reference depth detection layer to the thickness of the multilayer printed wiring board in the reference depth detection region.


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