The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Oct. 23, 2013
Applicant:
Kabushiki Kaisha Toyota Jidoshokki, Aichi-ken, JP;
Inventors:
Kiminori Ozaki, Kariya, JP;
Yasuhiro Koike, Kariya, JP;
Hiroaki Asano, Kariya, JP;
Hitoshi Shimadu, Kariya, JP;
Shigeki Kawaguchi, Tokai, JP;
Tomoaki Asai, Nagoya, JP;
Assignee:
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, Aichi-Ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); H05K 1/181 (2013.01); H05K 3/4007 (2013.01); H01L 24/29 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29017 (2013.01); H01L 2224/29018 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83815 (2013.01); H05K 3/3442 (2013.01); H05K 2201/0373 (2013.01); H05K 2201/09427 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0465 (2013.01); Y02P 70/611 (2015.11);
Abstract
A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.