The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Jun. 11, 2014
Applicant:

Eastman Kodak Company, Rochester, NY (US);

Inventors:

Deepak Shukla, Webster, NY (US);

Kevin M. Donovan, Bergen, NY (US);

Mark R. Mis, Rush, NY (US);

Assignee:

EASTMAN KODAK COMPANY, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/66 (2006.01); H01L 51/05 (2006.01); C08F 220/18 (2006.01); C08G 18/75 (2006.01); C08G 18/83 (2006.01); C08G 18/08 (2006.01); C08G 18/38 (2006.01); C08G 18/44 (2006.01); C08F 220/14 (2006.01); H01L 51/00 (2006.01); C08F 12/30 (2006.01);
U.S. Cl.
CPC ...
H01L 51/052 (2013.01); C08F 220/14 (2013.01); C08F 220/18 (2013.01); C08G 18/0819 (2013.01); C08G 18/381 (2013.01); C08G 18/44 (2013.01); C08G 18/6633 (2013.01); C08G 18/755 (2013.01); C08G 18/83 (2013.01); C08F 12/30 (2013.01); H01L 51/0053 (2013.01); H01L 51/0541 (2013.01); H01L 51/0545 (2013.01);
Abstract

A precursor dielectric composition comprises: (1) a photocurable or thermally curable thiosulfate-containing polymer that has a Tof at least 50° C. and comprises: an organic polymer backbone comprising (a) recurring units comprising pendant thiosulfate groups; and organic charge balancing cations, (2) optionally, an electron-accepting photosensitizer component, and (3) one or more organic solvents in which the photocurable or thermally curable thiosulfate-containing polymer is dissolved or dispersed. These precursor dielectric compositions can be applied to various substrates and eventually cured to form dielectric compositions or layers for various types of electronic devices.


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