The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Apr. 23, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, Kyoto-fu, JP;

Inventor:

Kiyoto Araki, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/29 (2013.01); H03H 3/02 (2006.01); H01L 21/311 (2006.01); H03H 9/17 (2006.01); H01L 41/047 (2006.01); H01L 41/332 (2013.01); H01L 41/312 (2013.01); H03H 9/02 (2006.01); H01L 41/113 (2006.01); G01C 19/5783 (2012.01);
U.S. Cl.
CPC ...
H01L 41/29 (2013.01); H01L 21/31144 (2013.01); H01L 41/0475 (2013.01); H01L 41/312 (2013.01); H01L 41/332 (2013.01); H03H 3/02 (2013.01); H03H 9/02047 (2013.01); H03H 9/173 (2013.01); G01C 19/5783 (2013.01); H01L 41/1138 (2013.01); H03H 2003/021 (2013.01); Y10T 29/42 (2015.01);
Abstract

A method for manufacturing a piezoelectric device including a piezoelectric thin film, a support member, a first electrode, and a cavity formed at a support member side of the first electrode between the piezoelectric thin film and the support member includes forming a sacrificial layer in an area to define the cavity, forming an etching adjustment layer which adjusts progress of etching in a region where the first electrode is exposed to a side of the piezoelectric thin film, simultaneously forming a through hole through which a portion of the sacrificial layer is exposed to the side of the piezoelectric thin film and an opening which the first electrode is exposed to the side of the piezoelectric thin film by etching the piezoelectric thin film and the etching adjustment layer, and removing the sacrificial layer through the through hole.


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