The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Jan. 17, 2013
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Stefan Illek, Donaustauf, DE;
Walter Wegleiter, Nittendorf, DE;
Karl Weidner, München, DE;
Stefan Stegmeier, München, DE;
Assignee:
OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/00 (2006.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 33/36 (2010.01); H01L 33/52 (2010.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); H01L 27/15 (2013.01); H01L 33/005 (2013.01); H01L 33/36 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 33/647 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0066 (2013.01);
Abstract
In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.