The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Feb. 03, 2016
Applicant:

Wisechip Semiconductor Inc., Miaoli County, TW;

Inventors:

Po-Hsin Lin, Miaoli County, TW;

Shih-Hung Chang, Miaoli County, TW;

Shang-Chih Lin, Miaoli County, TW;

Chia-Chi Huang, Miaoli County, TW;

I-Hsuan Lin, Miaoli County, TW;

Sheng-Hsu Shih, Miaoli County, TW;

Chien-Hsun Chen, Miaoli County, TW;

Yung-Cheng Tsai, Miaoli County, TW;

Chien-Le Li, Miaoli County, TW;

Assignee:

WiseChip Semiconductor Inc., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3297 (2013.01); H01L 27/3202 (2013.01); H01L 27/3204 (2013.01); H01L 27/3276 (2013.01);
Abstract

An OLED module equipped with vertical electric connection structure includes a substrate, a plurality of OLED clusters, an anode wire structure and a cathode wire structure. The substrate is extended toward a first direction. The OLED clusters are located on the substrate in the first direction. The anode wire structure includes a bottom layer wire set, an insulation layer, a middle wire layer set and a top layer wire set. The bottom layer wire set is located on the substrate. The insulation layer is located on the bottom layer wire set. The top layer wire set is located on the insulation layer. The cathode wire structure is located on the substrate and extended axially thereof. The middle layer wire set runs through the insulation layer and forms vertical connection between the bottom layer wire set and the top layer wire set.


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