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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9653421 B1

PDFFull Text
Expired
Date of Patent:
May. 16, 2017

Filed:

Apr. 07, 2015

Semiconductor device

Applicant:

Noda Screen Co., Ltd., Aichi, JP;

Inventor:

Atsunori Hattori, Komaki, JP;

Assignee:

NODA SCREEN CO., LTD., Aichi, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Jessica Manno

Assistant Examiner:

Mohammed R Alam

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 23/32 (2006.01); H01L 25/00 (2006.01); H01G 4/228 (2006.01); H01G 4/33 (2006.01); H01G 4/40 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01G 4/40 (2013.01); H01L 23/12 (2013.01); H01L 23/3114 (2013.01); H01L 23/32 (2013.01); H01L 23/49541 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/06 (2013.01); H01L 25/00 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A semiconductor device is provided with: a semiconductor chip die-bonding mounted face up on a support; an intermediate substrate connecting the semiconductor chip to a plurality of external connection portions; and a plurality of connection bumps connecting the semiconductor chip and the intermediate substrate. The plurality of connection bumps includes a plurality of power supply bumps connected to a plurality of electrode pads on the semiconductor chip for supplying power to the semiconductor chip. The intermediate substrate includes: a plurality of power supply pads connected to the plurality of electrode pads through the plurality of power supply bumps; a bump surface facing the semiconductor chip and having a plurality of power supply pads formed thereon; an external connection surface having a plurality of external connection pads formed thereon connected to the external connection portions; and a capacitor connected to the plurality of power supply bumps.

Find Patent Forward Citations

Hattori, Atsunori. (2017). Semiconductor device (U.S. Patent No. 9653421). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9653421

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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