The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Dec. 08, 2015
Applicants:

James T. Kelliher, Baltimore, MD (US);

Sandro J. Di Giacomo, Ellicott City, MD (US);

Cory E. Sherman, Arnold, MD (US);

Brian P. Wagner, Baltimore, MD (US);

Inventors:

James T. Kelliher, Baltimore, MD (US);

Sandro J. Di Giacomo, Ellicott City, MD (US);

Cory E. Sherman, Arnold, MD (US);

Brian P. Wagner, Baltimore, MD (US);

Assignee:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); H01L 23/532 (2006.01); H01L 39/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53285 (2013.01); H01L 39/02 (2013.01); H01L 39/2406 (2013.01);
Abstract

A method of forming a superconductor device is provided. The method includes depositing a non-oxide based dielectric layer over a substrate, depositing a photoresist material layer over the non-oxide based dielectric layer, irradiating and developing the photoresist material layer to form a via pattern in the photoresist material layer, and etching the non-oxide based dielectric layer to form openings in the non-oxide based dielectric layer based on the via pattern. The method further comprises stripping the photoresist material layer, and filling the openings in the non-oxide based dielectric with a superconducting material to form a set of superconducting contacts.


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