The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
May. 26, 2016
Applicant:
Sdi Corporation, Chang Hua, TW;
Inventor:
Ya-Cheng Fang, Chang Hua, TW;
Assignee:
SDI Corporation, Chang Hua, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49558 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29583 (2013.01); H01L 2224/29639 (2013.01); H01L 2924/0541 (2013.01); H01L 2924/0665 (2013.01);
Abstract
A lead frame has a metal base, a silver-plated layer, and a silver oxide layer. The silver-plated layer is formed between the metal base and the silver oxide layer. The silver oxide layer has a polar outer surface and a thickness of equal to or more than 1.3 nanometers. The silver oxide layer is beneficial to increase the adhesive strength between the lead frame and the molding compound and avoid delamination of the molding compound from the lead frame, so the lead frame of the present invention can pass a more severe moisture sensitivity level when exposed to the environment.