The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Sep. 24, 2015
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Jui-Ying Lin, Hsinchu County, TW;

Yen-Hsiang Fang, New Taipei, TW;

Chia-Hsin Chao, Taichung, TW;

Yao-Jun Tsai, Taoyuan County, TW;

Yi-Chen Lin, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/34 (2006.01); H01L 23/48 (2006.01); H01L 21/306 (2006.01); H01L 27/02 (2006.01); H01L 33/20 (2010.01); H01L 33/62 (2010.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01S 5/02 (2006.01); G02B 6/12 (2006.01); G02B 6/34 (2006.01); H01L 29/861 (2006.01); H01L 23/60 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); G02B 6/12 (2013.01); G02B 6/34 (2013.01); H01L 21/30604 (2013.01); H01L 21/486 (2013.01); H01L 21/76898 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/49827 (2013.01); H01L 23/60 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 27/0255 (2013.01); H01L 29/861 (2013.01); H01L 33/20 (2013.01); H01L 33/62 (2013.01); H01S 5/026 (2013.01); H01S 5/0208 (2013.01); H01S 5/02469 (2013.01); H01S 5/34 (2013.01); G02B 2006/12061 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/80 (2013.01); H01L 25/167 (2013.01); H01L 2224/04 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/08148 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32148 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48148 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/80801 (2013.01); H01L 2224/80805 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1434 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.


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