The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Apr. 26, 2016
Fujitsu Limited, Kawasaki-shi, Kanigawa, JP;
Makoto Suwada, Kawasaki, JP;
Mitsutaka Yamada, Atsugi, JP;
Masumi Suzuki, Kawasaki, JP;
Michimasa Aoki, Kawasaki, JP;
Keizou Takemura, Kawasaki, JP;
Shinichirou Okamoto, Yokohama, JP;
Kenji Katsumata, Odawara, JP;
Jie Wei, Hachioji, JP;
FUJITSU LIMITED, Kawasaki, JP;
Abstract
A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body.