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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9653379 B1

PDFFull Text
Date of Patent:
May. 16, 2017

Filed:

Mar. 10, 2016

Cooler and semiconductor device having cooler

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Takahiro Koyama, Matsumoto, JP;

Noriho Terasawa, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Teresa M Arroyo

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/34 (2006.01); F28F 7/00 (2006.01); F28D 15/00 (2006.01); F28F 27/00 (2006.01); H01L 23/473 (2006.01); H01L 23/367 (2006.01); H05K 7/20 (2006.01); F28F 3/02 (2006.01); F28F 3/12 (2006.01); F28F 3/04 (2006.01); F28F 27/02 (2006.01); F28F 13/12 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); F28D 15/00 (2013.01); F28F 3/02 (2013.01); F28F 3/022 (2013.01); F28F 3/048 (2013.01); F28F 3/12 (2013.01); F28F 13/12 (2013.01); F28F 27/02 (2013.01); H01L 23/3121 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/3736 (2013.01); H01L 23/49838 (2013.01); H01L 25/0655 (2013.01); H05K 7/20927 (2013.01); F28F 2255/04 (2013.01); H01L 23/3735 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A cooler for cooling a semiconductor module includes a top plate; a jacket having a side plate and a bottom plate and firmly fixed to the top plate; a refrigerant inflow port through which a refrigerant flows into a space surrounded by the top plate and jacket; a refrigerant outflow port through which the refrigerant flows out from the space; a plurality of fins firmly fixed to the top plate and disposed separately on each of the left and right relative to a main refrigerant path in the jacket to be inclined toward the inflow side of the main refrigerant path; heat transfer pins disposed on the top plate on the refrigerant inflow sides of the fins; and a curved plate-like bimetal valve having one end connected to each respective heat transfer pin and another free end.

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