The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Dec. 27, 2013
Murata Manufacturing Co., Ltd., Kyoto, JP;
Atsushi Seko, Kyoto, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
A method for producing an electronic component including a laminate, a circuit element provided therein, and external conductors electrically connected thereto. The method including steps of obtaining a mother laminate that has a plurality of the laminates arranged in a matrix-like state in a first direction and a second direction perpendicular thereto. The mother laminate is cut into the laminates. In the step of obtaining, the mother laminate is obtained such that the external conductors of two laminates adjacent in the first direction are joined, and circuit elements provided in the two laminates have a point-symmetrical relationship with each other. In the step of cutting, the mother laminate is cut along first cutoff lines extending in the second direction after the mother laminate is cut along second cutoff lines extending in the first direction. The external conductors are located on corresponding first cutoff lines.