logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9651979 B1

PDFFull Text
Date of Patent:
May. 16, 2017

Filed:

Oct. 28, 2015

Circuit carrier, method for producing a circuit carrier, method for producing a circuit arrangement, method for operating a circuit arrangement and method for producing a semiconductor module

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Thomas Hunger, Moehnesee, DE;

Carsten Ehlers, Moenchengladbach, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Lincoln Donovan

Assistant Examiner:

Khareem E Almo

Int. Cl.
CPC ...
H01L 21/00 (2006.01); G05F 3/02 (2006.01); H01L 21/48 (2006.01); H01L 21/54 (2006.01); H01L 23/498 (2006.01); B23K 1/00 (2006.01); H01L 23/053 (2006.01); H01L 23/15 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
G05F 3/02 (2013.01); B23K 1/0016 (2013.01); H01L 21/4857 (2013.01); H01L 21/54 (2013.01); H01L 23/053 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 24/27 (2013.01); H01L 25/065 (2013.01); H01L 23/3735 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A circuit carrier includes a dielectric isolation carrier, an upper metallization layer applied to the dielectric isolation carrier, and a dielectric coating. The upper metallization layer has a metallization section which has an underside facing the isolation carrier, a top side facing away from the isolation carrier, and a side surface closed in a ring-shaped fashion. The side surface laterally delimits the metallization section and extends continuously between the top side and the underside. The dielectric coating is on the side surface and the top side, and extends continuously from the side surface onto the top side.

Find Patent Forward Citations

Loading…