The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Dec. 12, 2016
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

John David Weickert, Fairfield, OH (US);

Andrew Scott Kessie, Springboro, OH (US);

Philip T. Smith, Cincinnati, OH (US);

Charles Rickards, Cincinnati, OH (US);

James R. Noel, Beverly, MA (US);

Gregory Griffin, Mason, OH (US);

Joshua Daniel Brown, Hamilton, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 15/06 (2006.01);
U.S. Cl.
CPC ...
G01N 15/0656 (2013.01); G01N 2291/02416 (2013.01);
Abstract

The present disclosure is directed to an integrated multi-chip module (MCM) sensor assembly having at least one electrostatic sensor and a circuit board. The electrostatic sensor includes an outer housing with an electrode and an amplifier configured therein. The electrode includes a first end and a second end separated by a predetermined length. The second end includes a sensing face that is substantially flush with an edge of the outer housing. Further, the electrode contains a plurality of electrons configured to respond to one or more charged particles that flow past the sensing face by moving either towards or away from the second end. Thus, the amplifier is electrically coupled to the electrode so as to detect a particle level flowing past the sensing face as a function of the electron movement. Moreover, the circuit board is configured within the outer housing and is electrically coupled to the sensor.


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