The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Mar. 17, 2016
Applicants:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Automotive Systems Inc., Inukami-gun, Shiga, JP;

Inventors:

Shigeki Sekiya, Tokyo, JP;

Sho Yoshida, Tokyo, JP;

Kyota Susai, Tokyo, JP;

Kengo Mitose, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 5/08 (2006.01); C22C 21/04 (2006.01); C22C 21/06 (2006.01); C22C 21/08 (2006.01); C22F 1/047 (2006.01); C22F 1/043 (2006.01); C22F 1/04 (2006.01); C22C 21/02 (2006.01); C22C 21/00 (2006.01); C21D 9/52 (2006.01); C21D 8/06 (2006.01); B21C 1/00 (2006.01); C22C 21/14 (2006.01); C22C 21/16 (2006.01); C22F 1/00 (2006.01); C22F 1/05 (2006.01); H01B 1/02 (2006.01); B23K 35/40 (2006.01);
U.S. Cl.
CPC ...
C22F 1/047 (2013.01); B21C 1/003 (2013.01); B23K 35/404 (2013.01); C21D 8/06 (2013.01); C21D 9/525 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); C22C 21/08 (2013.01); C22C 21/14 (2013.01); C22C 21/16 (2013.01); C22F 1/00 (2013.01); C22F 1/04 (2013.01); C22F 1/043 (2013.01); C22F 1/05 (2013.01); H01B 1/02 (2013.01); H01B 1/023 (2013.01); H01B 7/0045 (2013.01); Y10T 428/12 (2015.01);
Abstract

An aluminum alloy wire rod has a composition consisting of 0.1-1.0 mass % Mg; 0.1-1.0 mass % Si; 0.01-1.40 mass % Fe; 0.000-0.100 mass % Ti; 0.000-0.030 mass % B; 0.00-1.00 mass % Cu; 0.00-0.50 mass % Ag; 0.00-0.50 mass % Au; 0.00-1.00 mass % Mn; 0.00-1.00 mass % Cr; 0.00-0.50 mass % Zr; 0.00-0.50 mass % Hf; 0.00-0.50 mass % V; 0.00-0.50 mass % Sc; 0.00-0.50 mass % Co; 0.00-0.50 mass % Ni; and the balance being Al and incidental impurities, wherein at least one or none of Ti, B, Cu, Ag, Au, Mn, Cr, Zr, —Hf, V, Sc, Co and Ni is contained in the composition. A dispersion density of an MgSi compound having a particle size of 0.5 μm to 5.0 μm is less than or equal to 3.0×10particles/μm. In a sectional structure, a concentration of each of Si and Mg other than a compound is less than or equal to 2.00 mass %.


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