The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Jul. 06, 2015
Applicant:

Brunswick Corporation, Lake Forest, IL (US);

Inventors:

Raymond J. Donahue, Fond du Lac, WI (US);

Kevin R. Anderson, Fond du Lac, WI (US);

Terrance M. Cleary, Fond du Lac, WI (US);

Alexander K. Monroe, Fond du Lac, WI (US);

Assignee:

Brunswick Corporation, Lake Forest, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 21/00 (2006.01); C22C 21/04 (2006.01);
U.S. Cl.
CPC ...
C22C 21/04 (2013.01);
Abstract

A hypereutectic aluminum-silicon alloy is disclosed herein containing 18-20% by weight silicon, 0.03-0.20% by weight strontium and the balance aluminum, and alternatively with 3.0-6.0% by weight nickel. The alloy is substantially free of copper and manganese, but for any impurities that may exist. The alloy may also be substantially free of iron, but up to 1.2% by weight iron is permitted in certain embodiments. A more narrow strontium content of 0.05-0.10% by weight, may be used and the alloy may further include 0.3-1.2% by weight magnesium. In some embodiments 0.1-2.0% by weight nickel may be substituted with 0.1-2.0% by weight cobalt. The alloy of the present invention is preferably die cast resulting in castings that have a highly refined primary silicon microstructure with a modified eutectic structure and are highly ductile, but avoid soldering to the die casting dies.


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