The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Jul. 30, 2013
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Kiyoe Shigetomi, Ibaraki, JP;
Shou Takarada, Ibaraki, JP;
Masahiko Ando, Ibaraki, JP;
Katsuhiko Kamiya, Ibaraki, JP;
Takahiro Nonaka, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;
Abstract
Provided is a pressure-sensitive adhesive capable of realizing a pressure-sensitive adhesive layer having satisfactory adhesion performance and a high ink step absorbability. A radiation-curable pressure-sensitive adhesive, which contains a (meth)acryl-based polymer obtained by polymerizing a monomer component containing 30 to 90% by weight of an alkyl(meth)acrylate having an alkyl group of 10 to 22 carbon atoms at an ester end, and having a radically polymerizable functional group containing a carbon-carbon double bond.