The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Oct. 01, 2012
Applicants:

Fuji Chemical Company, Limited, Osaka-shi, Osaka, JP;

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Satoshi Kawanaka, Hirakata, JP;

Fumio Uchida, Daito, JP;

Yuji Nakano, Kameoka, JP;

Yoshiyuki Kawasumi, Osaka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); C08L 63/00 (2006.01); G02B 1/04 (2006.01); C08K 5/1565 (2006.01); C08G 59/42 (2006.01);
U.S. Cl.
CPC ...
C08K 3/36 (2013.01); C08G 59/4215 (2013.01); C08K 5/1565 (2013.01); C08L 63/00 (2013.01); G02B 1/04 (2013.01); C08K 2201/003 (2013.01);
Abstract

An epoxy resin composition is provided which includes a polycrystalline structure comprised of a plurality of monocrystalline structures. The plurality of monocrystalline structures are respectively comprised of a plurality of silicon oxide colloidal particles regularly aligned in epoxy resin. The plurality of silicon oxide colloidal particles are not contacted with each other. The mean distance between the silicon oxide colloidal particles adjacent to each other is less than 330 nm. The mean particle size of the plurality of silicon oxide colloidal particles is less than 290 nm. The concentration of the plurality of silicon oxide colloidal particles is 10-50% by mass. A relative permittivity of 4 or more is ensured. A method for producing the epoxy resin composition is provided. Building materials, ornaments and optical materials, each using the epoxy resin composition, are also provided.


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