The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Nov. 19, 2015
Applicants:

Basf SE, Ludwigshafen, DE;

Flexterra, Inc., Skokie, IL (US);

Inventors:

Ashok Kumar Mishra, Singapore, SG;

Subramanian Vaidyanathan, Singapore, SG;

Hiroyoshi Noguchi, Singapore, SG;

Florian Doetz, Singapore, SG;

Silke Koehler, Mannheim, DE;

Marcel Kastler, Mannheim, DE;

Assignees:

BASF SE, Ludwigshafen, DE;

FLEXTERRA, INC., Skokie, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 75/00 (2006.01); C08F 228/06 (2006.01); C08G 61/12 (2006.01); C09K 11/06 (2006.01); H01L 51/00 (2006.01); C08K 3/00 (2006.01); C08K 5/00 (2006.01); H01L 51/05 (2006.01); H01L 51/42 (2006.01);
U.S. Cl.
CPC ...
C08F 228/06 (2013.01); C08G 61/126 (2013.01); C08K 3/0008 (2013.01); C08K 5/0008 (2013.01); C09K 11/06 (2013.01); H01L 51/0036 (2013.01); H01L 51/0043 (2013.01); C08G 2261/124 (2013.01); C08G 2261/18 (2013.01); C08G 2261/3223 (2013.01); C08G 2261/3327 (2013.01); C08G 2261/344 (2013.01); C08G 2261/364 (2013.01); C08G 2261/414 (2013.01); C08G 2261/512 (2013.01); C08G 2261/5222 (2013.01); C08G 2261/91 (2013.01); C08G 2261/92 (2013.01); C09K 2211/1416 (2013.01); C09K 2211/1425 (2013.01); C09K 2211/1458 (2013.01); C09K 2211/1491 (2013.01); H01L 51/0545 (2013.01); H01L 51/0558 (2013.01); H01L 51/42 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract

Disclosed herein are new semiconductor materials prepared from dithienylvinylene copolymers with aromatic or heteroaromatic π-conjugated systems. Such copolymers, with little or no post-deposition heat treatment, can exhibit high charge carrier mobility and/or good current modulation characteristics. In addition, the polymers of the present disclosure can possess certain processing advantages such as improved solution-processability and low annealing temperature.


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