The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Mar. 28, 2012
Applicants:

Takuji Kimura, Kariya, JP;

Takahiro Takahashi, Handa, JP;

Hirokazu Nakanishi, Handa, JP;

Inventors:

Takuji Kimura, Kariya, JP;

Takahiro Takahashi, Handa, JP;

Hirokazu Nakanishi, Handa, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); C04B 35/645 (2006.01); B28B 1/00 (2006.01); B28B 3/02 (2006.01); B32B 18/00 (2006.01); C04B 35/111 (2006.01); C04B 35/56 (2006.01); C04B 35/626 (2006.01); C04B 35/634 (2006.01);
U.S. Cl.
CPC ...
C04B 35/645 (2013.01); B28B 1/002 (2013.01); B28B 3/025 (2013.01); B32B 18/00 (2013.01); C04B 35/111 (2013.01); C04B 35/5626 (2013.01); C04B 35/62695 (2013.01); C04B 35/63456 (2013.01); C04B 35/63488 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/604 (2013.01); C04B 2235/6023 (2013.01); C04B 2235/721 (2013.01); C04B 2235/77 (2013.01); C04B 2237/343 (2013.01); C04B 2237/36 (2013.01); H01L 21/6833 (2013.01);
Abstract

A method for producing an electrostatic chuckincludes the steps of (a) pouring a ceramic slurry containing a ceramic powder, a solvent, a dispersant, and a gelling agent into a first molding diein which an electrostatic electrode precursoris removably attached to an inner surface of the first molding die, gelatinizing the ceramic slurry by causing a chemical reaction of the gelling agent, and then removing the first molding dieto prepare an embedded-electrode-containing ceramic molded bodyX in which the electrostatic electrode precursoris embedded in a first ceramic molded body; (b) preparing a second ceramic molded body; and (c) preparing a stacked calcined bodyusing the embedded-electrode-containing ceramic molded bodyX and the second ceramic molded body, and conducting hot-press firing of the stacked calcined body


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