The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
Dec. 02, 2014
Hfm Packaging, Ltd., Pewaukee, WI (US);
Scott Hetherton, Oconomowoc, WI (US);
HFM Packaging, LTD., Pewaukee, WI (US);
Abstract
A tamper evident label flap positioned to cover an opening in a package. The label flap includes a base layer having a top surface and a bottom surface. A top layer is attached to the base layer by an adhesive layer. A tamper evident structure is located in at least one designated area between the base layer and the top layer. The tamper evident structure includes a first ink layer applied to the base layer and a second ink layer applied to the first ink layer. The first ink layer and the second ink layer are held together in a weaker bond than a bond between the top layer and the base layer. When the label flap is initially pulled from the package, the first ink layer and the second ink layer separate and define a visible permanent de-lamination which signifies the package has been opened.