The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Dec. 21, 2012
Applicant:

Valeo Systemes Thermiques, Le Mesnil Saint Denis, FR;

Inventors:

Maryline Thorailler, Ormesson sur Marne, FR;

Frédéric Autran, Paris, FR;

Assignee:

Valeo Systemes Thermiques, Le Mesnil Saint Denis, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/14 (2006.01); B60K 37/06 (2006.01); B60K 35/00 (2006.01); G02F 1/1333 (2006.01); G06F 3/041 (2006.01); B32B 37/00 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
B60K 37/06 (2013.01); B32B 37/003 (2013.01); B32B 37/1018 (2013.01); B32B 38/145 (2013.01); B60K 35/00 (2013.01); G02F 1/13338 (2013.01); G02F 1/133308 (2013.01); G06F 3/0412 (2013.01); B60K 2350/1028 (2013.01); B60K 2350/2039 (2013.01); G02F 2001/133331 (2013.01); G06F 2203/04103 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/24868 (2015.01);
Abstract

The invention relates to a method for manufacturing an interface module (), the interface module () including a display member () that is to be visible through a transparent slab (S), characterized in that it comprises the steps of: silk-screening an opaque ink () onto certain areas of a film () so as to define frames or symbols; depositing adhesive (C) between the film () on the silk-screened ink () side, and the transparent slab (S) of the interface module (); and adhering, and laminating the film () onto the transparent slab (S) of the interface module (). The invention also relates to the associated interface module produced according to said method.


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