The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

May. 21, 2013
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Norihiko Enomoto, Nagoya, JP;

Nobuharu Kakehashi, Toyoake, JP;

Michio Nishikawa, Nagoya, JP;

Assignee:

DENSO CORPORATION, Kariya, Aichi-pref., JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60H 1/00 (2006.01); B60K 6/22 (2007.10); B60H 1/08 (2006.01); B60H 1/22 (2006.01); B60W 10/30 (2006.01); B60W 20/00 (2016.01); B60L 1/02 (2006.01); B60L 3/00 (2006.01); B60L 11/12 (2006.01); B60L 11/18 (2006.01); B60K 11/02 (2006.01); F01P 7/16 (2006.01); F01P 5/10 (2006.01); B60K 1/04 (2006.01); B60K 1/00 (2006.01);
U.S. Cl.
CPC ...
B60H 1/00278 (2013.01); B60H 1/004 (2013.01); B60H 1/08 (2013.01); B60H 1/22 (2013.01); B60K 6/22 (2013.01); B60L 1/02 (2013.01); B60L 3/0023 (2013.01); B60L 3/0046 (2013.01); B60L 3/0061 (2013.01); B60L 11/12 (2013.01); B60L 11/1874 (2013.01); B60L 11/1875 (2013.01); B60W 10/30 (2013.01); B60W 20/00 (2013.01); B60H 2001/00307 (2013.01); B60K 1/04 (2013.01); B60K 11/02 (2013.01); B60K 2001/005 (2013.01); B60L 2240/36 (2013.01); B60L 2240/425 (2013.01); B60L 2240/445 (2013.01); B60L 2240/545 (2013.01); B60L 2240/662 (2013.01); B60L 2260/44 (2013.01); B60L 2260/56 (2013.01); F01P 7/165 (2013.01); F01P 2005/105 (2013.01); F01P 2050/24 (2013.01); F01P 2060/04 (2013.01); F01P 2060/12 (2013.01); Y02T 10/642 (2013.01); Y02T 10/7005 (2013.01); Y02T 10/705 (2013.01); Y02T 10/7077 (2013.01); Y02T 10/7291 (2013.01); Y02T 90/16 (2013.01);
Abstract

A first heat transfer medium circuit includes a first path and a second heat transfer medium circuit includes a second path are formed independently from each other by operating a first switching valve and a second switching valve in conjunction with each other to make each of multiple flow passages of a first flow passage group communicate with either the first path or the second path. The first and second heat transfer medium circuits in which the first path and the second path are connected to each other in series is formed by operating the first switching valve and the second switching valve in conjunction with each other to make each of the multiple flow passages of the first flow passage group communicate with both the first path and the second path.


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