The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2017

Filed:

Jan. 26, 2015
Applicant:

Konica Minolta, Inc., Chiyoda-ku, Tokyo, JP;

Inventor:

Hironobu Yamaguchi, Tachikawa, JP;

Assignee:

KONICA MINOLTA, INC., Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/175 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/195 (2006.01); B41J 2/045 (2006.01); B41J 2/155 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04563 (2013.01); B41J 2/1433 (2013.01); B41J 2/14072 (2013.01); B41J 2/14201 (2013.01); B41J 2/14233 (2013.01); B41J 2/155 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); B41J 2/17593 (2013.01); B41J 2/195 (2013.01); B41J 2202/19 (2013.01);
Abstract

Provided are an inkjet head and an inkjet recording device that can effectively heat an ink near nozzles of a nozzle board or an ink inside a head chip. The inkjet head includes the head chip in which a nozzle board, an intermediate plate, a pressure chamber board, a spacer board, and a wiring board are joined in order, a common ink chamber forming member provided at a side of the wiring board of the head chip to form at least a part of a common ink chamber, and a heater provided to the common ink chamber forming member. The nozzle board is smaller than the intermediate plate when the head chip is viewed from the side of the nozzle board in plan view. A thermal conductive member being in contact with the heater and joined with the nozzle board and the wiring board across the head chip is provided. At least a part of the wiring board and a part of the common ink chamber forming member are joined through the thermal conductive member. The thermal conductive member is joined with a side surface of the nozzle board and a nozzle board-side surface of the intermediate plate, the nozzle board-side surface being larger than the nozzle board.


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