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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9649827 B1

PDFFull Text
Date of Patent:
May. 16, 2017

Filed:

Sep. 29, 2015

Molding packaging material and molded case

Applicant:

Showa Denko Packaging Co., Ltd., Isehara-shi, Kanagawa, JP;

Inventors:

Honglin Wang, Isehara, JP;

Yuji Minamibori, Isehara, JP;

Assignee:

Showa Denko Packaging Co., Ltd., Kanagawa, JP;

Attorney:

Keating and Bennett, LLP

Primary Examiner:

Rena D Cronin

Int. Cl.
CPC ...
B32B 15/08 (2006.01); H01M 2/02 (2006.01); B32B 15/095 (2006.01); H01M 10/0525 (2010.01); B32B 7/12 (2006.01); B32B 15/06 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 25/08 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); B32B 27/34 (2006.01); B32B 15/088 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 7/12 (2013.01); B32B 15/06 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 25/08 (2013.01); B32B 27/08 (2013.01); B32B 27/304 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); H01M 2/0287 (2013.01); H01M 2/0292 (2013.01); H01M 10/0525 (2013.01); B32B 15/088 (2013.01); B32B 15/095 (2013.01); B32B 27/34 (2013.01); B32B 2250/03 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/10 (2013.01); B32B 2307/306 (2013.01); B32B 2307/31 (2013.01); B32B 2307/514 (2013.01); B32B 2307/584 (2013.01); B32B 2307/714 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7246 (2013.01); B32B 2439/00 (2013.01); B32B 2439/70 (2013.01); B32B 2439/80 (2013.01); B32B 2457/10 (2013.01);
Abstract

A molding packaging material includes an outer substrate layer made of a heat-resistant resin, an inner sealant layer made of a thermoplastic resin, a metallic foil layer provided between the outer substrate layer and the inner sealant layer, and a protection coat layer formed on a side opposite to the metallic foil layer side of the outer substrate layer. The protection coat layer is made of a resin composition including a main resin containing a phenoxy resin and a urethane resin, and a curing agent, and has a thickness of 0.1 μm to 10 μm.

Find Patent Forward Citations

Wang, Honglin. (2017). Molding packaging material and molded case (U.S. Patent No. 9649827). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9649827

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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