The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2017
Filed:
May. 23, 2012
Applicants:
Hirohiko Hirao, Kagawa, JP;
Noriaki Yamaji, Kagawa, JP;
Masato Nakanishi, Kagawa, JP;
Takayuki Murai, Kagawa, JP;
Inventors:
Hirohiko Hirao, Kagawa, JP;
Noriaki Yamaji, Kagawa, JP;
Masato Nakanishi, Kagawa, JP;
Takayuki Murai, Kagawa, JP;
Assignee:
SHIKOKU CHEMICALS CORPORATION, Kagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/20 (2006.01); B23K 35/36 (2006.01); C07D 233/64 (2006.01); C23C 22/52 (2006.01); C23F 11/14 (2006.01); C23F 11/16 (2006.01); H05K 3/28 (2006.01); B23K 1/00 (2006.01); H05K 1/09 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 1/20 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); B23K 35/36 (2013.01); B23K 35/3615 (2013.01); C07D 233/64 (2013.01); C23C 22/52 (2013.01); C23F 11/149 (2013.01); C23F 11/165 (2013.01); H05K 1/09 (2013.01); H05K 3/282 (2013.01); B01D 2252/20473 (2013.01); B23K 2201/42 (2013.01);
Abstract
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.