The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9648755 B1

PDF
Full Text
Expired
Date of Patent:
May. 09, 2017

Filed:

Dec. 17, 2014
Applicant:

Philips Lighting Holding B.v., Eindhoven, NL;

Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/32 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H05K 3/44 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H05K 1/0284 (2013.01); H05K 1/092 (2013.01); H05K 3/0014 (2013.01); H05K 3/0061 (2013.01); H05K 3/125 (2013.01); H05K 3/1216 (2013.01); H05K 3/44 (2013.01); H05K 1/056 (2013.01); H05K 3/321 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10113 (2013.01); H05K 2203/1461 (2013.01);
Abstract

A method for manufacturing a non-planar printed circuit board assembly () is disclosed. The method comprises providing a planar formable substrate () for supporting a conductive material () and at least one electronic component (), printing a circuit pattern of an uncured conductive material () on the planar substrate (), forming the substrate () and the uncured conductive material () into a non-planar shape, and curing the conductive material (), wherein the substrate () comprises a metal sheet and an electrically insulating coating () arranged between the metal sheet and the conductive material ().


Find Patent Forward Citations

De Vaan, Adrianus Johannes Stephanus Maria. (2017). Method for manufacturing a non-planar printed circuit board assembly (U.S. Patent No. 9648755). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9648755

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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