The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Oct. 09, 2014
Applicant:

Rsm Electron Power, Inc., Deer Park, NY (US);

Inventor:

Ching Au, Port Washington, NY (US);

Assignee:

RSM Electron Power, Inc., Deer Park, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); F21V 29/74 (2015.01); F21Y 101/00 (2016.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H05K 1/0206 (2013.01); F21V 29/74 (2015.01); F21Y 2101/00 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H05K 2201/066 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A flexible circuit board includes an electrically insulating top sheet and an electrically insulating bottom sheet. A plurality of conductive traces is positioned between the electrically insulating top and bottom sheets. A first conductive trace has a first contact pad, and a second conductive trace has a second contact pad. The first and second contact pads are exposed through at least one opening in the electrically insulating top sheet, and each of the first and second contact pads are configured to be connected to an LED. A third contact pad is exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device.


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