The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Aug. 08, 2014
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventors:
Youko Nakamura, Matsumoto, JP;
Norihiro Nashida, Nagano, JP;
Assignee:
FUJI ELECTRIC CO, LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/28 (2006.01); H05K 1/02 (2006.01); H01L 31/048 (2014.01); H01L 33/56 (2010.01); H01L 23/12 (2006.01); H01L 33/52 (2010.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 7/00 (2006.01); H01L 23/29 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 23/12 (2013.01); H01L 23/28 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 24/01 (2013.01); H01L 31/048 (2013.01); H01L 33/52 (2013.01); H01L 33/56 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H01L 25/072 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/351 (2013.01); H05K 2201/098 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09727 (2013.01);
Abstract
A semiconductor device includes: a conductive-patterned insulating substrate; conductive blocks fixed to conductive patterns of the conductive-patterned insulating substrate; a semiconductor chip fixed to each conductive block; a printed circuit board that has a conductive post fixed to the semiconductor chip; and a resin. The semiconductor device is configured such that the average volume of a conductive film per unit area of each conductive pattern around a section thereof, to which the corresponding conductive block is fixed, is reduced from the conductive block toward the outside.