The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Dec. 02, 2015
Applicants:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Stmicroelectronics SA, Montrouge, FR;

Inventors:

Nicolas Hotellier, Jarrie, FR;

François Guyader, Montbonnot, FR;

Vincent Fiori, Grenoble, FR;

Richard Fournel, Lumbin, FR;

Frédéric Gianesello, Saint Pierre d'Albigny, FR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H01L 21/762 (2006.01); H01L 21/764 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01L 21/762 (2013.01); H01L 21/764 (2013.01); H01L 21/7624 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/0011 (2013.01);
Abstract

An electronic device has a rear plate that includes a substrate rear layer, a substrate front layer and a dielectric intermediate layer between the substrate rear and front layers. An electronic structure is on the substrate front layer and includes electronic components and electrical connections. The substrate rear layer includes a solid local region and a hollowed-out local region. The hollowed-out local region extends over all of the substrate rear layer. The substrate rear layer does not cover at least one local zone of the dielectric intermediate layer corresponding to the hollowed-out local region.


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