The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Mar. 06, 2014
Applicant:

Trw Automotive U.s. Llc, Livonia, MI (US);

Inventors:

Neil Gordon Murray, Jr., Wixom, MI (US);

Mark Ramsay, Livonia, MI (US);

Assignee:

TRW Automotive U.S. LLC, Livonia, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H05K 1/18 (2013.01); H05K 5/0034 (2013.01); H05K 5/0073 (2013.01); H05K 5/0078 (2013.01); H05K 5/0221 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10401 (2013.01); H05K 2203/1327 (2013.01); Y10T 403/471 (2015.01); Y10T 403/472 (2015.01); Y10T 403/49 (2015.01);
Abstract

A circuit board mounting arrangement is provided including a circuit board and a press fit mounting bushing including a cylindrical inner piece and an outer piece secured to the inner piece. The outer piece has a plurality of radially projecting, deformable elements and the circuit board has a cylindrical opening having a diameter less than an outer diameter of the radially projecting deformable elements. The deformable elements deform when the mounting bushing is pushed into the cylindrical opening of the circuit board so as to hold the mounting bushing to the circuit board. The circuit board and press fit bushing are then overmolded.


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