The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2017
Filed:
Jul. 22, 2013
Applicants:
Frank Ferdinandi, Cambridge, GB;
Rodney Edward Smith, Essex, GB;
Mark Robson Humphries, Essex, GB;
Inventors:
Assignee:
Semblant Global Limited, London, GB;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H05K 3/00 (2013.01); H05K 3/282 (2013.01); H01L 24/48 (2013.01); H01L 2224/4569 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45686 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48747 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81395 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83024 (2013.01); H01L 2224/83205 (2013.01); H01L 2224/83395 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/85395 (2013.01); H01L 2224/85447 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0179 (2013.01);
Abstract
A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.